Other
Services
provided by
the Pilot Line

PIX4life was conceived as a one stop shop for silicon nitride integrated photonics for life science applications. To accomplish this goal we are able to provide a set of services to complement fabrication. These are:

Consultancy

With several years of expertise in the field, the members of the consortium can assist any company, institution or interested person to evaluate the feasibility, both technically and economically, of a given photonic integrated project for life sciences applications.

This assistance may include among other services: technology and foundry platform evaluation, mapping of required functionalities into specific devices for circuit integration, component and system performance evaluation, intellectual property evaluation, prototype cost estimation, and scalability study for mass production escalation.

Consultancy prices will start from a discounted price of 2,000€ during the course of the PIX4life project.

Design

The PIX4life Pilot Line can support your business or institution in doing, or helping you to do, the design and layout of a photonic integrated circuit in silicon nitride, in three different ways.

– Design support: For those who want to design their own PIC, a design house is available to support them. This covers answering any design questions they may have, reviewing the layout for manufacturability, test and packaging advices, and design rule checking (DRC). Also, two different software licences (PhoeniX and Luceda) can be acquired at a discounted price of 1,150€ per run during PIX4life project.

– Standard design: If your project makes use of the standard building blocks available at the two offered platforms, this should be your option.

– Custom Design: Trust the design engineers of VLC Photonics to help you out reaching your target specifications by designing a PIC based on your technical requirements.

TypeCell sizeDuring Pix4life
Design support1 block1,000€
Standard design1 block2,000€
Custom design*1 block4,000€

*A 10% discount for EU industry customers, and 20% for EU academic customers will be applied during PIX4life project.

The process will include assembly of the designs into the masks, fabrication and validation of the wafers, and dicing of the wafers into dies for delivery.

Characterization

The Characterization of test structures and basic building blocks at the bare die level might be done if required after chip fabrication in order to evaluate functionalities, component performance and design variations.

The characterization price will start at 4,000€ during the course of the PIX4life project.

Packaging

The packagings of the bare dies into a housing with electrical/optical connectors and additional interfaces (e.g. microfluidics, microlenses, etc.) will be coordinated through Ireland’s Tyndall National Institute through the European Photonic Packaging Pilot Line, PIXAPP.

The prices will vary depending on the complexity, starting at:

– Low-complexity: 900€/unit

– Mid-complexity: 1,450€/unit

– High-complexity: 2,250€/unit

More information on this at the PIXAPP website.

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